PCB Manufacturing and Assembly FAQ

This page answers common questions about PCB fabrication, materials, HDI structures, PCB assembly, engineering review, testing, and ordering. For a project-specific answer, send us the available design files and requirements for review.

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FAQ

FAQ Topics

PCB Manufacturing

PCB Materials and Stack-Up

HDI, Microvias and Sequential Lamination

PCB Assembly

Files and Engineering Review

Testing and Quality

Ordering and Shipping

PCB Manufacturing

We support rigid, flexible, rigid-flex, multilayer, HDI, RF and microwave, heavy copper, aluminum, and controlled impedance PCB projects. Final feasibility depends on the design, materials, stack-up, quantity, and inspection requirements. See our PCB fabrication capabilities.

Yes. We support prototype and production requirements. We review the files, quantity, materials, and process requirements before confirming the production plan.

PCB fabrication produces the bare circuit board. PCB assembly places and solders components onto that board. We can review projects that require fabrication only or both fabrication and PCB assembly.

Yes. We manufacture custom PCBs from customer-supplied production data. Send the available Gerber or ODB++ data, drill files, fabrication drawing, quantity, and special requirements for review.

We review the production data before manufacturing. The review may cover the stack-up, materials, holes, spacing, copper, solder mask, impedance requirements, routing, and other design-specific risks.

PCB Materials and Stack-Up

The material should match the electrical, thermal, mechanical, and assembly requirements of the product. Frequency, loss target, operating temperature, board structure, thickness, and budget can all affect the choice. Our PCB materials page explains the main material groups.

High-Tg material has a higher glass transition temperature than standard FR-4. It may be considered when the board will face higher process or operating temperatures, but the complete material data must still be reviewed.

Consider an RF or microwave laminate when dielectric stability and signal loss are important to the design. The correct choice depends on frequency, loss target, impedance, stack-up, copper profile, and assembly conditions. See our RF and microwave PCB page.

Yes. We can review the proposed layer structure based on the material, thickness, copper, impedance, via, and routing requirements. Stack-up details should be confirmed before the design is released for production.

Provide the target impedance, trace type, critical layers or nets, proposed stack-up, copper thickness, and relevant fabrication notes. We use these inputs to review the construction and manufacturability. Learn more about controlled impedance PCBs.

HDI, Microvias and Sequential Lamination

An HDI PCB uses high-density interconnections such as laser-drilled microvias, blind or buried vias, fine routing, and compact layer structures. The exact structure depends on the routing and component requirements. See our HDI PCB capabilities.

Sequential lamination is used when the required via structure cannot be produced in one lamination and drilling sequence. It is common in HDI designs with blind, buried, stacked, or staggered microvias.

The number of cycles depends on the layer build-up and the layers connected by each via. We must review the complete stack-up and drill structure before confirming the build sequence.

Stacked microvias are positioned above one another across adjacent layers. Staggered microvias are offset from one layer to the next. The correct structure depends on routing density, available space, fabrication risk, and reliability requirements.

The lower microvia normally needs to be filled and planarized before another microvia can be built above it. The fill method and complete structure must be confirmed during engineering review. Read more about sequential lamination and stacked vias.

PCB Assembly

We support SMT, through-hole, BGA, mixed-technology, flex, and rigid-flex assembly projects. We confirm the inspection and test methods from the assembly files and project requirements.

For turnkey PCB assembly, we manage the required component sourcing and assembly work. Partial turnkey combines customer-supplied parts with parts we source. For consigned assembly, the customer supplies the components for us to assemble.

Yes. We can review the BOM and source components for an assembly project. Manufacturer part numbers, approved alternatives, sourcing restrictions, and traceability requirements should be stated clearly.

We report the sourcing issue before using a substitute. The customer must review and approve any proposed alternative before we use it in the order.

Provide the Gerber or ODB++ data, BOM, pick-and-place file, assembly drawing, component data, and inspection or test requirements. The pad design, stencil, placement, reflow, and X-ray requirements should be reviewed for the specific package. See our BGA PCB assembly page.

Files and Engineering Review

Send Gerber or ODB++ data, drill files, a fabrication drawing, quantity, and the available board specifications. Include the stack-up, material, copper, finish, impedance, and test requirements when they apply.

Send the PCB production data, BOM, pick-and-place file, assembly drawing, quantity, and testing requirements. Schematics, programming files, and functional test instructions are also useful when they apply.

Yes. Send the information that is currently available. We will identify the missing items that are needed before quotation or production can be confirmed.

We send an engineering question that identifies the issue and the information needed to resolve it. We do not make a design change that affects the approved production data without customer confirmation.

Native files can help with engineering communication, but the manufacturing files must still be supplied or generated and approved. The accepted file set depends on the design platform and the requested service. Our PCB layout service explains the available design support.

Testing and Quality

The inspection plan depends on the board and order requirements. It may include visual inspection, dimensional checks, AOI, electrical testing, impedance testing, microsection review, and checks of holes, plating, solder mask, and surface finish.

Assembly inspection may include SPI, AOI, X-ray, visual inspection, electrical checks, and functional testing. We agree on the required methods with the customer before production because each project has different needs.

X-ray inspection is useful for solder joints that cannot be inspected directly, including joints under BGA and other bottom-terminated packages. The required coverage and acceptance criteria should be defined for the project. See our X-ray PCB inspection service.

We can confirm the available reports and records during the quotation review. State the required document type, format, standard, and acceptance criteria before the order is released.

Provide the order reference, affected quantity, board markings, clear photos, inspection results, and a detailed description of the issue. Keep the affected boards and packaging available until the review is complete.

Ordering and Shipping

Use our Contact Us page to submit the available files, quantity, and project requirements. Clear manufacturing, assembly, testing, and documentation requirements help us review the project correctly.

Pricing depends on the design, materials, stack-up, quantity, fabrication processes, components, assembly work, testing, documentation, and delivery requirements. We quote the project after reviewing the relevant files instead of using one fixed price.

Lead time depends on engineering review, material and component availability, board complexity, quantity, process steps, testing, and production capacity. We confirm the schedule for the specific project during quotation and order review.

Yes. Provide the previous order reference and identify any changes in quantity, files, materials, components, testing, or documentation. We will confirm the applicable file revision before production.

We confirm the shipping method, destination, account details, packaging needs, and trade terms for each order. We provide tracking or shipping documents when they are available from the selected logistics provider.

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Send your project files and requirements for engineering review and quotation.

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