Tel :+86 13425156463
Email:sales@toplinecircuit.com

FAQ

Pre-Sales

1.How can I get a quote? What documents do I need to provide (Gerber files, PCB specifications, quantity, and delivery time)?

HDI (High-Density Interconnector) PCBs are designed with more advanced features, including microvias, finer traces, and higher component density, compared to regular PCBs. This makes HDI PCBs ideal for compact, high-performance applications like smartphones, wearables, and advanced automotive systems. They offer higher signal integrity, reduce board size, and improve overall electrical performance.

Delivery time depends on the PCB specifications, order quantity, material availability, and production complexity. Standard PCB orders can usually be completed faster, while HDI, high-frequency, rigid-flex, or special-material PCBs may require more time. If you need expedited delivery, please contact our sales team before placing the order so we can check production capacity and provide the fastest available schedule.

Yes. We understand the importance of protecting customer designs and confidential information. We can sign an NDA before reviewing your Gerber files, BOM, drawings, or other project documents. All customer files are handled with strict confidentiality.

Yes. We provide one-stop PCB manufacturing and assembly services, including PCB fabrication, component sourcing, SMT assembly, through-hole assembly, functional testing, and final inspection. Please provide the Gerber files, BOM, Pick & Place file, and assembly requirements for evaluation.

Yes. We can assist with component sourcing through reliable suppliers. Customers may also provide approved vendor lists or designated part numbers. If any components are obsolete, long-lead-time, or unavailable, we will inform you and suggest alternatives for your approval before production.

Engineering & DFM

Yes. We provide DFM review before production to help identify potential manufacturing issues, such as spacing, drill size, annular ring, solder mask clearance, impedance requirements, stack-up concerns, and assembly risks. If any issue is found, our engineering team will contact you for confirmation before manufacturing.

Impedance control is important for high-speed, RF, microwave, and differential signal designs because it helps maintain signal integrity and reduce signal reflection, distortion, and transmission loss. Controlled impedance is commonly required for USB, HDMI, Ethernet, RF modules, communication equipment, and high-speed digital applications.

Impedance control is implemented through proper stack-up design, trace width, trace spacing, dielectric thickness, copper thickness, and material selection. The typical impedance tolerance is ±10%, while tighter tolerance may be available depending on the design, material, and production capability. Please provide your impedance requirements when requesting a quote.

Yes. Our engineering team can recommend a suitable PCB stack-up based on your layer count, material, thickness, impedance, thermal, and mechanical requirements. For high-speed, high-frequency, HDI, or rigid-flex PCBs, stack-up confirmation is especially important before production.

For PCB fabrication, Gerber files, drill files, stack-up requirements, material specifications, and special notes are usually required. For PCB assembly, please also provide the BOM, Pick & Place file, assembly drawings, polarity markings, and testing requirements. Complete files help us provide faster and more accurate feedback.

If our engineering team finds any potential issue, we will not proceed directly to production without confirmation. We will send you an engineering query or DFM feedback for review. Production will start only after the issue is clarified and approved by the customer.

Materials & Process

We support a wide range of PCB materials, including FR-4, high Tg FR-4, halogen-free materials, aluminum substrate, copper substrate, Rogers, Taconic, PTFE-based high-frequency materials, polyimide materials for flexible PCBs, and other specialty laminates depending on project requirements.

High-frequency PCBs commonly use materials such as Rogers, Taconic, PTFE, ceramic-filled laminates, and other low-loss materials. These materials provide stable dielectric properties, low signal loss, and better performance for RF, microwave, radar, antenna, and communication applications.

Yes. We support HDI PCB manufacturing with microvias, blind vias, buried vias, laser drilling, fine lines, fine spacing, and multi-layer stack-up structures. HDI capability depends on the layer count, via structure, material, board thickness, and production requirements.

We can provide common surface finishes such as HASL, lead-free HASL, ENIG, immersion silver, immersion tin, OSP, hard gold, and other finishes based on project requirements. The right surface finish depends on solderability, shelf life, bonding requirements, assembly process, and application environment.

Yes. We support thick copper PCB manufacturing for power electronics, industrial control, automotive electronics, power supplies, battery systems, and high-current applications. The available copper thickness depends on the design, layer structure, line width, spacing, and manufacturing feasibility.

Quality & Testing

We follow strict quality control procedures throughout material inspection, production, electrical testing, final inspection, and packaging. Our manufacturing process is managed according to industry standards and customer-specific requirements to ensure stable and reliable PCB quality.

Yes. Electrical testing is available to check for open circuits and short circuits before shipment. For complex, high-density, or high-reliability PCBs, electrical testing is strongly recommended to ensure product quality and reduce the risk of assembly failure.

We use multiple inspection methods, including visual inspection, AOI, dimensional inspection, solder mask inspection, hole quality inspection, surface finish inspection, electrical testing, and final quality control. For PCB assembly projects, additional inspection such as SPI, AOI, X-ray, and functional testing may be available depending on the project.

Yes. We can provide quality documents according to customer requirements, such as electrical test reports, material certificates, COC, inspection reports, microsection reports, impedance test reports, and other required production records. Please inform us of your documentation requirements before placing the order.

For high-reliability PCBs, we focus on material control, process stability, stack-up accuracy, plating quality, impedance control, solderability, dimensional accuracy, and final testing. We also perform engineering review before production to reduce manufacturing risks and improve product reliability.

Please contact us as soon as possible and provide clear photos, order information, inspection results, and a description of the issue. Our quality team will review the case and help identify the root cause. If the issue is confirmed to be related to our manufacturing process, we will provide a reasonable solution.

After-Sales & Shipping

We support international shipping by express courier, air freight, sea freight, and customer-designated logistics providers. Common express options include DHL, FedEx, UPS, and other carriers depending on the destination and shipping requirements.

Yes. Once the order is shipped, we will provide the tracking number and shipping details. You can track the shipment through the courier’s official website or contact our sales team for assistance.

PCBs are usually vacuum-packed with desiccant and humidity indicator cards, then protected with bubble wrap, foam, or cartons depending on the order size and product type. Proper packaging helps prevent moisture, oxidation, scratches, and transportation damage.

Yes. Once the order is shipped, we will provide the tracking number and shipping details. You can track the shipment through the courier’s official website or contact our sales team for assistance.

If the shipment is delayed or damaged, please contact us immediately with the tracking number, photos of the package, and a description of the issue. We will coordinate with the logistics provider and help resolve the problem as quickly as possible.

Yes. For repeat orders, production can usually be arranged faster because the engineering files and production records are already available. However, the delivery time still depends on material availability, order quantity, production capacity, and process complexity. For customized projects, the required MOQ still applies, and small-quantity customization is not supported.

GET A FREE QUOTE